This high-precision CNC deep-hole drilling machine is an advanced processing equipment specifically developed for modern precision manufacturing industries. Adopting a modular design concept, it integrates drilling, boring, and reaming functions to meet various complex deep-hole machining requirements. The equipment is particularly suitable for high-precision applications such as medical devices, precision molds, and semiconductor equipment.
This equipment adopts the external chip evacuation (gun drilling) method, making it the most specialized deep-hole machining device with superior capability for processing coaxial holes, eccentric holes, and indexed holes on shaft workpieces. It is primarily used for machining components like hydraulic cylinder oil passages and piston rod oil holes.
Featuring a hydraulic chuck and hydraulic steady rest for efficient clamping, the workpiece can move laterally and can be indexed at any angle. Both the workpiece and cutting tool are controlled by servo spindle motors for precision operation.
| Working Range | Parameter Item | ZK2103YG | ZK2104YG |
|---|---|---|---|
| Drilling Range | Drilling diameter (mm) | Φ4~Φ35 | Φ4~Φ40 |
| Max Depth | Max depth of drilling (mm) | 2000 | 1600 |
| Workpiece Size | Max length (mm) | 2700 | 4000 |
| Z-axis | Fast moving speed (m/min) | 3 | 3 |
| Spindle | Rotational speed range (r/min) | 500~6000 | 500~6000 |
| Motor | Main motor power (Kw) | 3.7 | 5.5 |
| Control | Numerical control system: KND-1000M | ||



Utilizes multi-point sensors and AI algorithms for thermal deformation compensation, ensuring precision fluctuations remain within 0.005mm.
Optional B-axis rotary table enables 5-axis simultaneous machining for complex angled and irregular-shaped holes.
Built-in Industrial IoT module for real-time data collection on tool wear and spindle vibration, enabling remote predictive maintenance.
Designed for orthopedic screws and dental implants with dedicated chip removal and cleanroom-compatible protection.
Micro deep-hole solutions for cooling channels, processing holes as small as Φ0.5mm with 50:1 depth ratios.
Ultra-precision machining for wafer handling systems with constant-temperature oil cooling (±0.5°C).
Customization: We offer dedicated ultra-deep-hole models (ratio >100:1), specialized hard-material solutions, and fully automated production line integration.
After-Sales: 12-month standard warranty (extendable to 36 months), 24/7 global technical assistance, and comprehensive on-site training.