Utilizes high-power, highly stable ultra-fast ultraviolet laser for direct ablation and vaporization of materials, achieving micron-level machining line widths with no heat-affected zone.
Excellent beam shaping design allows for adjustments in beam spatial distribution, polarization, etc., expanding micro-machining capabilities.
High-precision galvanometer enables high-speed, high-precision control of beam deflection, achieving small-area high-speed precision machining with machining accuracy better than ±2μm and local dimensional accuracy better than 2μm.
Realizes large-area precision machining through high-precision linear motor-driven platform translation, with repeatability accuracy up to ±1μm.
Z-axis is electrically adjustable to accommodate materials of different thicknesses, meeting the requirements for fine machining of three-dimensional structures.
Extended precision rotary axis enables fine structural forming of irregularly shaped parts.
High-resolution industrial camera for full-field error correction of the galvanometer, high-precision positioning and focusing, etching depth measurement, and machining dimension measurement.
On-machine power detection and compensation ensure reliable long-term machining.
Supports machining with up to 256 layer parameters and processes two-dimensional, three-dimensional vector, and image files such as DXF, AI, and PNG.
Adopts a marble tabletop to enhance the overall stability of the system, with all mechanical components carefully selected to ensure long-term precision.
Suitable for machining virtually all solid materials including glass, organics, metals, ceramics, etc., enabling fine etching, blind holes, through holes, slotting, and cutting.