Model NO.:AT-61168
Origin:China
Package Size:150.00cm * 90.00cm * 150.00cm
Gross Weight:2000.000kg
The small-format high-speed microhole machining system is a precision micro-machining equipment based on a high-power, high-stability ultraviolet laser. It is particularly suitable for small-format high-speed microhole machining and can also meet large-format machining requirements through a micron-level high-speed linear motor platform. The system integrates advanced laser technology, precision motion control, and online monitoring technology to provide micron-level precision microhole machining solutions for a variety of materials.
- Utilizes a high-power, high-stability ultraviolet laser to directly ablate and vaporize materials, resulting in a μm-level heat-affected zone and a minimum processing spot size of 5 μm.
- Achieves high-speed, high-precision etching on small formats through precise galvanometer control of beam deflection.
- The Z-axis is electrically adjustable to accommodate materials of different thicknesses and meet the requirements for etching three-dimensional structures.
- A side-axis high-resolution industrial camera is used for high-precision focusing to ensure machining accuracy and repeatability.
- The system employs a marble table top to enhance overall stability, and all mechanical components are carefully selected to ensure long-term precision.
- Capable of processing metals, ceramics, organics, glass, and other materials, enabling etching, blind holes, through holes, slotting, and cutting.
- Minimum processing line width of 5 μm and a processing range of 50*50 mm.
Electronics Manufacturing: Semiconductor flexible circuit board cutting, ITO film layer etching, microelectronic device manufacturing, printing template preparation, biochip preparation.
Medical Industry: Drug filtration, biosensors, microfluidic chips, CC IT positive sample preparation (pore sizes 1-30 μm, suitable for all packaging materials such as vials and ampoules).
Precision Machinery: Precision micro-mold forming, micro-nozzle processing, microhole filtration components.
New Energy: Lithium battery separator microhole processing (pore size ≤ 3 μm), hydrogen fuel cell bipolar plate microchannel processing.
Scientific Research: Microstructure research, material science experiments, micro-nano manufacturing technology development.
Other Applications: Carbon fiber micro-cutting, PI micro-masking, silicone microneedle molds, film layer circuit precision etching, inter digitated electrode preparation.
| Category |
Parameter |
FM-UV3 |
| Laser | Wavelength | 355 nm |
| Laser | Power | > 3W @ 40 kHz (3-40W optional) |
| Laser | Modulation Frequency | 1-200 kHz |
| Laser | Beam Quality M² | < 1.3 |
| Galvanometer | Scan Range | < 50*50 mm |
| Galvanometer | Repeatability | < 1 μm |
| Galvanometer | Scan Speed | ≤ 3.5 m/s |
| Z-Axis | Travel | 200 mm |
| Z-Axis | Positioning Accuracy | ≤ ±5 μm |
| CCD Monitoring | Camera Pixels | 5 million |
| Processing | Minimum Pore Size | 5 μm |
| Processing | Processing Thickness | ≤ 0.5 mm |
| Processing | Microhole Accuracy | ± 3 μm |
| Processing | Depth-to-Width Ratio | > 10:1 |
| Cooling | Cooling Method | Water-cooled |
| Power | Power Supply | 220V 50-60Hz 12A |
| Dimensions | Dimensions | 750*1100*1700 mm |
Technical services, technology development, technology consulting, and technology exchange are central to operations. Expertise includes computer software and hardware, graphic and textual design, and the sales of specialized functional glass, new optical materials, and optical instruments. The scope covers specialized equipment for semiconductor devices, experimental analysis instruments, CNC machine tools, electronic components, electromechanical equipment, metal cutting/welding machinery, and photovoltaic components.
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Frequently Asked Questions
1. What is the minimum hole size this system can process?
The system can achieve a minimum processing pore size of 5 μm with a high-precision spot size.
2. Which materials are compatible with the UV laser machining system?
It is capable of processing a wide range of materials including metals, alloys, ceramics, organics, glass, and silicon wafers.
3. Does the system support 3D structure etching?
Yes, the Z-axis is electrically adjustable to accommodate different material thicknesses and meet 3D etching requirements.
4. What is the processing accuracy for microholes?
The system provides high precision with a microhole processing accuracy of ± 3 μm and a galvanometer repeatability of < 1 μm.
5. What industries typically use this microhole machining system?
It is widely used in electronics manufacturing, medical device production (like biosensors and microfluidic chips), precision machinery, and new energy sectors.
6. How is the equipment cooled during operation?
The system utilizes a water-cooled method to ensure stable operation of the high-power ultraviolet laser.
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