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Basic Information
Structure
Vertical Drilling Machine
Certification
CE, ISO 9001
Transport Package
Polywood Box
Production Capacity
1000/ Year
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Product Description
Three-axis precision machining system capable of high-speed precision etching
- High-power infrared fiber lasers for ablation with minimum processing spot size of 20μm.
- Precision galvanometer controls beam deflection for high-speed etching of small areas.
- Separate gantry XY precision platform ensures large-format precision machining.
- Electrically adjustable Z-axis accommodates varying material thicknesses and 3D etching.
- Optional rangefinder high-resolution industrial camera for high-precision positioning.
- Marble countertop enhances overall stability and long-term mechanical precision.
- Superior Accuracy: Minimum micropore diameter of 5μm and overall machining accuracy of ±4μm.
- Versatile Application: Suitable for metals, ceramics, silicon wafers, glass, and organic materials.
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Technical Specifications
| Category |
Parameter |
FM-SD50 Value |
| Laser System | Wavelength | 1064 nm |
| Power | 50W |
| Modulation Frequency | 40~1000kHz |
| Beam Quality M2 | <1.3 |
| Power Stability (8h) | <3% |
| Galvanometer | Scan Range | <50*50mm |
| Repeatability | <1μm |
| Positioning Accuracy | ≤±20μm |
| Scan Speed | ≤3.5m/s |
| XY Workbench | Journey | 300*300mm (customizable) |
| Repeatability | ≤±5μm |
| Positioning Accuracy | ≤±20μm |
| Z-Axis | Journey | 200mm |
| Repeatability | ≤±3μm |
| Processing Capacity | Minimum Aperture | 20μm |
| Processing Materials | Silicon, Metals, Alloys, Ceramics |
| Utility | Power Consumption | ≤1200W |
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Packing & Delivery
Standard Warranty
12 months after shipping
Extended Warranty
Optional up to 36 months
Global Support
24/7 technical assistance
Free Training
On-site or remote sessions
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Manufacturing Capabilities
The facility is a technology-driven enterprise specializing in the R&D, production, and sales of industrial and scientific research laser application systems. Precision laser solutions are provided for micro-hole, micro-groove, micro-welding, scribing, cutting, and feature forming.
Successfully developed systems include Femtosecond Laser Precision Processing, Picosecond Laser Ultra-Fine Processing, and Roll-to-Roll Thin Film Micro-Hole Processing systems. These serve industries such as biomedicine, semiconductors, new energy, and scientific research institutions worldwide.
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Frequently Asked Questions
What materials can this system process?
The system is designed for precision micromachining of metals, ceramics, silicon wafers, glass, and various organic materials.
What is the typical lead time for standard models?
Standard models typically require 1-3 months for production, though stock may be available for certain high-demand items.
What is the machining accuracy of the system?
The system provides an overall machining accuracy of ±4μm, with local feature accuracy reaching better than 3μm.
Are training services included with the purchase?
Yes, we provide both on-site and remote operation and maintenance training free of charge to ensure your team can operate the equipment effectively.
What are the power requirements for the machine?
The system operates on 220V 50~60Hz with a 12A current requirement and a maximum power consumption of ≤1200W.
Is the processing area customizable?
The standard machining area is 300*300mm, but customization options are available to meet specific project requirements.