a Three-Axis Precision Machining System Capable of High-Speed Precision Etching

Customization: Available
After-sales Service: Video Support for Free
Warranty: 1year

Product Description

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Basic Information

Structure
Vertical Drilling Machine
Layout
Vertical
Controlling Mode
CNC
Number of Shaft
3
Automatic Grade
Automatic
Precision
High Precision
Certification
CE, ISO 9001
Condition
New
Transport Package
Polywood Box
Origin
China
Production Capacity
1000/ Year
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Product Description

Three-axis precision machining system capable of high-speed precision etching

Precision Machining System
  • High-power infrared fiber lasers for ablation with minimum processing spot size of 20μm.
  • Precision galvanometer controls beam deflection for high-speed etching of small areas.
  • Separate gantry XY precision platform ensures large-format precision machining.
  • Electrically adjustable Z-axis accommodates varying material thicknesses and 3D etching.
  • Optional rangefinder high-resolution industrial camera for high-precision positioning.
  • Marble countertop enhances overall stability and long-term mechanical precision.
  • Superior Accuracy: Minimum micropore diameter of 5μm and overall machining accuracy of ±4μm.
  • Versatile Application: Suitable for metals, ceramics, silicon wafers, glass, and organic materials.
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Technical Specifications

Category Parameter FM-SD50 Value
Laser SystemWavelength1064 nm
Power50W
Modulation Frequency40~1000kHz
Beam Quality M2<1.3
Power Stability (8h)<3%
GalvanometerScan Range<50*50mm
Repeatability<1μm
Positioning Accuracy≤±20μm
Scan Speed≤3.5m/s
XY WorkbenchJourney300*300mm (customizable)
Repeatability≤±5μm
Positioning Accuracy≤±20μm
Z-AxisJourney200mm
Repeatability≤±3μm
Processing CapacityMinimum Aperture20μm
Processing MaterialsSilicon, Metals, Alloys, Ceramics
UtilityPower Consumption≤1200W
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Equipment Application

Application Sample 1
Application Sample 2
Application Sample 3
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Other Product Lines

Product Line 1
Product Line 2
Product Line 3
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Packing & Delivery

Standard Warranty 12 months after shipping
Extended Warranty Optional up to 36 months
Global Support 24/7 technical assistance
Free Training On-site or remote sessions
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Manufacturing Capabilities

Factory Overview

The facility is a technology-driven enterprise specializing in the R&D, production, and sales of industrial and scientific research laser application systems. Precision laser solutions are provided for micro-hole, micro-groove, micro-welding, scribing, cutting, and feature forming.

Successfully developed systems include Femtosecond Laser Precision Processing, Picosecond Laser Ultra-Fine Processing, and Roll-to-Roll Thin Film Micro-Hole Processing systems. These serve industries such as biomedicine, semiconductors, new energy, and scientific research institutions worldwide.

Frequently Asked Questions

What materials can this system process?
The system is designed for precision micromachining of metals, ceramics, silicon wafers, glass, and various organic materials.
What is the typical lead time for standard models?
Standard models typically require 1-3 months for production, though stock may be available for certain high-demand items.
What is the machining accuracy of the system?
The system provides an overall machining accuracy of ±4μm, with local feature accuracy reaching better than 3μm.
Are training services included with the purchase?
Yes, we provide both on-site and remote operation and maintenance training free of charge to ensure your team can operate the equipment effectively.
What are the power requirements for the machine?
The system operates on 220V 50~60Hz with a 12A current requirement and a maximum power consumption of ≤1200W.
Is the processing area customizable?
The standard machining area is 300*300mm, but customization options are available to meet specific project requirements.

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