Picosecond Laser Ultra-Precision Machining System for Semiconductors

Customization: Available
Structure: Vertical Drilling Machine
Layout: Vertical

Product Description

Basic Information
Controlling Mode
CNC
Automatic Grade
Automatic
Precision
High Precision
Certification
CE, ISO 9001
Condition
New
Origin
China
Production Capacity
1000/ Year
Package
Polywood Box
Product Description

Picosecond laser ultra-precision machining system for semiconductors

Picosecond Laser Machining System
  • High-power and high-stability UV laser for direct ablation of gasification materials.
  • μm-level processing aperture and heat-affected zone.
  • High-speed precision galvanometers for beam deflection control.
  • Micron-level high-speed linear motor platform for large-format processing.
  • Electrically adjustable Z-axis for various material thicknesses.
  • Super-resolution industrial camera for error correction and online measurement.
  • Stable marble countertop structure with high-quality mechanical components.
  • Minimum micropore diameter of 5μm with overall accuracy of ±4μm.
Equipment Application

Ideal for precision micromachining of metals, ceramics, silicon wafers, glass, and organics.

Application 1
Application 2
Application 3
Technical Specifications
Items Parameter FM-UVM3A FM-UVM3B
Laser Wave 355nm Standard UV Output
Power >3W@40kHz 3-40W optional
Scan Area Galvo Area <50*50mm <15*15mm
XY Table Travel Working Range 300*300mm (600*600mm optional)
Positioning Accuracy XY Precision ≤±3um
Repeatability Standard ≤±1um
Minimum Spot Precision Spot 8um 5um
Weight KG 1200Kg
Other Product Lines
Product Line 1
Product Line 2
Product Line 3
Service & Support
🛡️
Standard Warranty: 12 months after shipping.
Extended Warranty: Optional up to 36 months.
🌍
Global Support: 24/7 technical assistance group.
🎓
Free Training: On-site or remote maintenance training.
Company Profile

Our factory is a technology-driven enterprise specializing in the R&D, production, and sales of industrial and scientific research laser application systems. We provide precision laser application solutions for micro-hole, micro-groove, micro-welding, scribing, cutting, and feature forming.

Our successfully developed series includes Femtosecond Laser Precision Processing, Picosecond Laser Ultra-Fine Processing, and Laser Micromachining systems serving biomedicine, semiconductors, and new energy sectors.

Factory Overview
Frequently Asked Questions
Are you a factory or a trading company?
We are a factory specialized in manufacturing laser drilling and machining systems. We also cooperate with several partners to provide comprehensive solutions for our clients.
What is the typical delivery time for machines?
We maintain stock for popular items. Standard models typically require 1 to 3 months for production, while specialized custom projects may take longer.
What payment methods do you accept for international orders?
We accept T/T and L/C for machine purchases. For tools and smaller components, we can discuss alternative payment arrangements.
How quickly can you provide a technical quotation?
General inquiries are replied to within 1 hour. For technical machine specifications, quotations for standard models are provided within 3 days, and special projects within 1 week.
Which materials can your laser systems process?
Our systems are designed for high-precision machining of glass, organics, various metals, ceramics, and silicon wafers.

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